College Intern – R&D Mechanical Engineer

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College Intern – R&D Mechanical Engineer
Description -
What a College Intern – R&D Mechanical Engineer does at HP:
Works with R&D team on printer product development.
Documents design rules on various areas of product design.
Uses CAD software to design mechanical parts for printer product.
Uses simulation and Artificial Intelligent software to understand the design robustness.
Goes through the design process from design intent to actual prototype.
Establishes optimized machine setting and test specification for maximum yield gain with reduced cycle time.
Develops loss function with statistical test to validate test specification to filter defects.

Individuals who do well in this role at HP, usually possess:
Currently pursing Degree in Mechanical Engineering.
Able to commit for a full-time internship around May 2027 for 5-6 months.
Excellent analytical thinking, project management and problem-solving skills.
Fundamental knowledge of mechanical product design.
Mechanical Drawing Skill using CAD Software will be an added advantage.
Passion in hands-on projects.
Practical experience in AI/ ChatGPT application development to support engineering problem analysis.

Sustainable impact is HP’s commitment to create positive, lasting change for the planet, its people, and our communities. This serves as a guiding principle for delivering on our corporate vision – to create technology that makes life better for everyone, everywhere.

HP is a Human Capital Partner – we commit to human capital development and adopting progressive workplace practices in Singapore.

#Li-Post

Job -
Administration
Schedule -
Full time
Shift -
No shift premium (Singapore)
Travel -

Relocation -
Equal Opportunity Employer (EEO) -

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

For more information, review HP’s   EEO Policy or read about your rights as an applicant under the law here: “ Know Your Rights: Workplace Discrimination is Illegal "

大学实习生 - 研发机械工程师
描述 -
惠普公司的大学实习生 - 研发机械工程师工作内容：
与研发团队合作，参与打印机产品的开发工作。
记录产品设计各领域的设计规则。
使用CAD软件设计打印机产品的机械零件。
使用仿真和人工智能软件了解设计的稳健性。
从设计意图到实际原型，完成整个设计流程。
建立优化的机器设置和测试规范，以在减少周期时间的同时实现最大产量增益。
开发具有统计测试的损失函数，以验证测试规范并筛选缺陷。

在惠普表现良好的此岗位人员通常具备：
目前正在攻读机械工程学位。
能够在2027年5月左右全职实习5-6个月。
出色的分析思维、项目管理和解决问题的能力。
对机械产品设计有基础知识。
使用CAD软件的机械制图技能将是额外的优势。
热衷于实际项目。
具有AI/ChatGPT应用开发的实践经验，以支持工程问题分析。

可持续影响是惠普的承诺，为地球、其人民和我们的社区创造积极、持久的变化。这作为实现我们企业愿景的指导原则——创造让世界各地每个人的生活更美好的技术。

惠普是人力资本合作伙伴——我们致力于人力资本发展，并在新加坡采用进步的工作场所实践。

#Li-Post

工作 -
行政管理
工作时间 -
全职
轮班 -
无轮班津贴（新加坡）
出差 -

搬迁 -
平等机会雇主（EEO）-

惠普公司为所有员工和潜在员工提供平等的就业机会，不因种族、肤色、宗教、性别、国籍、血统、公民身份、性取向、年龄、残疾或受保护退伍军人身份、婚姻状况、家庭状况、身体或精神残疾、医疗状况、怀孕、基因倾向或携带者身份、服役状态、政治隶属关系或任何其他受适用的国家、联邦、州和地方法律保护的特征而有所区别。

请放心，如果您选择提供所要求的信息，您不会受到任何不利对待。此信息自愿提供。所获信息将严格保密。

有关更多信息，请查阅惠普的EEO政策，或在此处了解您作为申请人在法律下的权利："了解您的权利：职场歧视是非法的"

⚑ 岗位信息收录自公开招聘页（ATS 官方），以雇主官网为准