岗位大厅/Engineering/Customer Platform, SDK & Interoperability Architect - Randa 1.6T AEC Platform

Kandou AI · 33天前 · 来源 ATS 官方

Customer Platform, SDK & Interoperability Architect - Randa 1.6T AEC Platform

Hyderabad办公方式未标注
全职Engineering
薪资未披露

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信号由后台自动核验生成,仅供参考;判断权在你。设计案:GHOST-JOB-P1

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必备技能

AIAPIAnalyticsAutomationC++FirmwareI2CNetworkingPythonREST

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职位描述

At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.

Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.

We are looking for a Customer Platform, SDK & Interoperability Architect.

Location: Hyderabad, India

Responsabilities

· Architect the customer-facing software platform for Randa, including the adaptation layer, SDK, diagnostic tools, telemetry interfaces and reference integrations.

· Define stable APIs, extension points and versioning contracts that support customer-specific requirements without forking the core platform.

· Own C and Python management libraries, command-line tools, log-analysis utilities, integration examples and developer documentation.

· Lead interoperability and qualification across NIC, switch-ASIC and host-BMC platforms; maintain the test matrix, known-failure catalog and regression strategy.

· Represent Kandou software in customer technical discussions and escalations, converting field requirements into governed, reusable platform capabilities.

· Partner with firmware, platform validation, product management and field engineering to deliver secure, backward-compatible and supportable customer releases.

Essential Experience

· 10+ years of platform, embedded or systems software experience, including architecture or technical leadership on shipping products.

· Device-adjacent software experience on networking silicon, AEC/AOC, optical modules, retimers, storage or comparable high-speed hardware.

· Strong API and SDK architecture skills with hands-on C and/or C++ plus Python development.

· Experience designing adaptation, plugin or hook-based architectures that isolate customer-specific logic behind stable interfaces.

· Customer or OEM integration experience across NICs, switch platforms, BMCs, drivers or management software.

· Experience with semantic versioning, backward compatibility, release governance and technical documentation for external developers.

· Working knowledge of hardware management and sideband interfaces such as I2C/SMBus, MCTP or similar protocols.

Excellent customer communication, technical decision-making and cross-functional leadership skills; BS in Electrical Engineering, Computer Engineering or Computer Science, or equivalent experience.

Useful Experience

· CMIS, OSFP MSA, SFF conventions or pluggable-module management software.

· Hyperscaler or tier-one OEM qualification and field-issue triage.

· REST, gRPC, Go or Rust bindings, and schema-driven API development.

· Telemetry pipelines, diagnostic analytics and privacy-aware customer data handling.

· Hardware-in-loop lab automation, host emulation and automated interoperability testing.

· Secure software supply chain, artifact signing, access isolation and standards-group participation.

If this is the role you have been looking for and you want to be part of a growing Company, with an exciting future then we would love to hear from you. Together We Kandou It!!

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公司 · Company

Kandou AI

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Hyderabad来源:ATS 官方

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